LRA resonant frequency explained.

This document outlines the key design considerations for migrating from NOR Flash to Everspin MRAM and provides guidance to support a successful transition.

The photodiode used for optical detection of the atomic resonance in a passive rubidium frequency standard (RFS) is a critical component that can limit the radiation hardness of the standard at high neutron-fluence levels.

Basic considerations in the design of silicon photodiodes for desired performance characteristics will be discussed. Various parameters used to characterize photodiodes will be introduced.

Our objective here is to examine the suitability of silicon photodiodes as the transducer, and to discuss the calibration accuracy, reproducibility and stability that are likely to be achieved from a commercial company.

Mechanical-alignment applications of electro-optical instruments have expanded dramatically during the past three years in the construction, machinetool, aircraft and aerospace industries, increasing demands for new types of position-sensing detectors.

This document addresses OEMs who want to understand how MCX N facilitates the implementation of CRA requirements

This document elaborates on the use of EdgeLock Discrete portfolio features to reduce implementation complexity and to ease the compliance to the requirements mandated by the CRA

This document addresses OEMs who want to understand how i.MX93 can facilitate the implementation of CRA requirements.

Enabling improved efficient patient care – with solutions for radiology, oncology, cardiology and emergency medicine.

HUBER+SUHNER has emerged as a trusted partner in the Space market for passive microwave components that can be used for satellite testing in clean rooms as well as in a thermal vacuum environment

Secure, reliable and continuous coverage for mission-critical networks.

The HUBER+SUHNER cost-effective product line-up for your test equipment always helps you to achieve highest precision and reliability.

This application note is based on Würth Elektronik standard cable types and helps to understand which points to consider when selecting a cable for custom tailored cable assemblies.

The YAGEO Group METCOM Automotive Applications Guide provides engineers with practical insights and application examples for integrating METCOM series metal composite power inductors into automotive power electronics systems.

Application note for Wurth RF gain block amplifier.

This application note provides a basic overview of signal generation, control, and configuration for use with the SL1680, SL1640, and SL1620 embedded processors.

This document summarizes power consumption across typical use case configurations for the Astra Machina Evaluation System, with SL1680, SL1640 and SL1620 SoCs

This application note details the Power Management IC (PMIC) solution for the Astra Machina platform, ensuring efficient power distribution, precise power sequencing, and optimized Bill of Material (BOM) cost.

This application note details the CAN Driver Module connection for core modules containing the SL16x0 SoC.

This application note provides guidelines for connecting MIPI DSI LCM displays to the Astra™ Machina Foundation Series. I

This document lists the qualified components for Synaptics’ SL1680 consumer.

This document details the I2S and PDM Interfaces of the Astra Machina SoC.

This document outlines the estimated product lifetime of the Astra™ SL1620.

This document provides PCB design and layout guidelines for integrating the Synaptics SL1620 with DDR4 and DDR3 memory.

This application note provides an overview of the GPIO pin multiplexing (pinmux) system for the Astra™ Machina SL1620 hardware platform.

This document outlines the estimated product lifetime of the Astra™ SL1680.

This application note provides PCB design and layout guidelines for integrating DDR4 and LPDDR4(x) memory with the SL1640 processor.

This document outlines best practices for soldering surface mount devices (SMDs) to PCBs, including reflow profile guidelines, moisture sensitivity management, and land pattern design.

This document details UART connection to Astra™ Machina Foundation Series evaluation modules containing the SL16xx and SL261x SoCs

This document provides guidance on establishing Power over Ethernet (PoE) connections for the Astra™ Machina Foundation Series.

This application note details the 10Base-T1S Ethernet interface to Astra™ Machina SL16x0 series processor.

This application note provides detailed connection and guidelines of the Serial Peripheral Interface (SPI) with the SL1620, SL1640, SL1680, and SL2610 RDK.

This application note provides detailed guidelines for connecting and configuring the eMMC with the SL1620, SL1640, SL1680 and SL2610 RDK.

This application note outlines the connection process for integrating an RGB LCD module with the Astra™ Machina Foundation Series using the Synaptics 4-in-1 LCM adapter board.

This document provides a detailed guide on connecting the Astra Machina Foundation Series to HDMI displays via a MIPI DSI to HDMI converter, including required hardware, connection diagrams, and setup instructions for seamless video and audio transmission.

This application note details the connection and operating of a Keypad by using a GPIO Expander.

This document provides PCB design and layout guidelines for integrating the Synaptics SL1680 with LPDDR4 and LPDDR4x memory.

This application note provides detailed connection guidelines for TWSI with the SL1620, SL1640, SL1680, and SL2610 RDK.

This application note details the MIPI CSI Camera Module connection for core modules containing SL2619, SL2617, SL2613, SL2611, and SL1680 SoCs.

The purpose of this document is to outline the qualification plans and results for the SL1680 consumer and industrial product, manufactured by TSMC using 12nm FFC process.

This application note details the guidelines for connecting and configuring an SD card with the SL1620, SL1640, and SL1680 RDK

This document outlines the estimated product lifetime of the Astra™ SL1640.

Application note for Synaptics general ESD/EOS control methods.

Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Transport refrigeration systems require precise temperature control and constant monitoring to operate their complex thermal cycles with cargo integrity and regulatory compliance.